China International Semiconductor Executive Summit

Amkor Technology is pleased to be part of the CISES 2019 event being held in Shanghai on September 5-6.

Amkor will be presenting the following:

Sept 5 – 11:45-12:05 (Advanced Packaging Session)
Advanced Packaging: The Rise of Heterogeneous Integration“, Curtis Zwenger, VP, Adv Package & Technology Integration

Sept. 6 – 14:45-15:05 (Automotive Session)
Automotive Semiconductor Packaging – Where Are We Headed?“, Curtis Zwenger, VP, Adv Package & Technology Integration

Curtis Zwenger will also be a panelist during the panel discussion moderated by Merck on Friday, September 6 from 15:20-15:50.

The China International Semiconductor Executive Summit brings together semiconductor executives from around the world to discuss issues related to Greater China.

When: September 5, 2019 - September 6, 2019 Where: Shanghai, China Location: Grand Kempinski Hotel Shanghai

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