중국 글로벌 반도체 임원 정상회담

Amkor Technology is pleased to be part of the CISES 2019 event being held in Shanghai on September 5-6.

앰코는 아래와 같은 내용을 발표할 예정입니다.

Sept 5 – 11:45-12:05 (Advanced Packaging Session)
Advanced Packaging: The Rise of Heterogeneous Integration“, Curtis Zwenger, VP, Adv Package & Technology Integration

Sept. 6 – 14:45-15:05 (Automotive Session)
Automotive Semiconductor Packaging – Where Are We Headed?“, Curtis Zwenger, VP, Adv Package & Technology Integration

Curtis Zwenger will also be a panelist during the panel discussion moderated by Merck on Friday, September 6 from 15:20-15:50.

The China International Semiconductor Executive Summit brings together semiconductor executives from around the world to discuss issues related to Greater China.

When: September 5, 2019 - September 6, 2019 Where: Shanghai, China Location: Grand Kempinski Hotel Shanghai

Events 더 보기

SEMICON Europa

SemIsrael Expo 2019

ICCAD China 2019