중국 글로벌 반도체 임원 정상회담
Amkor Technology is pleased to be part of the CISES 2019 event being held in Shanghai on September 5-6.
앰코는 아래와 같은 내용을 발표할 예정입니다.
Sept 5 – 11:45-12:05 (Advanced Packaging Session)
“Advanced Packaging: The Rise of Heterogeneous Integration“, Curtis Zwenger, VP, Adv Package & Technology Integration
Sept. 6 – 14:45-15:05 (Automotive Session)
“Automotive Semiconductor Packaging – Where Are We Headed?“, Curtis Zwenger, VP, Adv Package & Technology Integration
Curtis Zwenger will also be a panelist during the panel discussion moderated by Merck on Friday, September 6 from 15:20-15:50.
중국 인터내셔널 반도체 임원 정상회의는 전 세계 반도체 기업인이 모여 중국 관련 정보를 논의하는 자리입니다.