The power discrete for medium power applications

The DPAK (TO-252) package follows the JEDEC standard and is configured for surface mount applications. The DPAK package is suitable for medium power applications designed for low on-resistance and high-speed switching MOSFETs such as motor drivers, power supply circuits, DC-DC converters, consumer and automotive products.


  • Low on-resistance and high current density due to thick Al wire bonding
  • Full turnkey available from wafer saw through test and packing
  • Green materials: Pb-free plating and halogen-free mold compound


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