The power discrete for medium power applications

Amkor’s DPAK (TO-252) package follows the JEDEC standard and is configured for surface mount applications.

The DPAK package is suitable for medium power applications designed for low on-resistance and high-speed switching MOSFETs such as motor drivers, power supply circuits, DC-DC converters, consumer and automotive products.

Features

  • Low on-resistance and high current density due to thick Al wire bonding
  • Full turnkey available from wafer probe through test and packing
  • Green materials: Pb-free plating and halogen-free mold compound

Questions?

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