中国国际半导体高层峰会

Amkor Technology is pleased to be part of the CISES 2019 event being held in Shanghai on September 5-6.

Amkor 将发表下列演讲:

Sept 5 – 11:45-12:05 (Advanced Packaging Session)
Advanced Packaging: The Rise of Heterogeneous Integration“, Curtis Zwenger, VP, Adv Package & Technology Integration

Sept. 6 – 14:45-15:05 (Automotive Session)
Automotive Semiconductor Packaging – Where Are We Headed?“, Curtis Zwenger, VP, Adv Package & Technology Integration

Curtis Zwenger will also be a panelist during the panel discussion moderated by Merck on Friday, September 6 from 15:20-15:50.

来自世界各地的半导体行业高管将齐聚中国国际半导体高峰论坛,讨论与大中华区有关的问题。

When: September 5, 2019 - September 6, 2019 地点:中国上海 Location: Grand Kempinski Hotel Shanghai

更多未来大事件

TSES 2020

第 22 届 Electronics Packaging Technology Conference

CSIA – ICCAD 2020