Solutions for mobile applications

Amkor’s System in Package (SiP) is becoming popular with the industry’s demand for higher levels of integration and lower cost. Our SiP technology is an ideal solution in markets that demand a smaller size with increased functionality. We have a proven track record as the industry leader in SiP design, assembly and test. These products are built in our latest state of the art factory in Korea.

Packages for small form factor

SiP

System in Package

DSMBGA

Double Sided Mold Package

AiP/AoP

Antenna in/on Package

Applications

RF
Wearables
Automotive Compute

Mobile solutions for 5G and wireless connectivity.

  • RFFE modules, AiP/AoP
  • Integration, shielding
  • Test, turnkey service
  • Supply chain management
  • Best-in-class manufacturing

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Quick to market using “off the shelf” components and industry-leading design rules.

  • Watch, earbuds, fitness, medical
  • Package miniaturization
  • Performance, high integration
  • Test, turnkey service

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High-performance solutions in a small footprint.

  • Infotainment, ECU, connectivity
  • IATF16949 certified
  • Test, turnkey service
  • Supply chain management

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Questions?

Contact an Amkor expert by clicking the request info button below.