Solutions for mobile applications

Amkor’s System in Package (SiP) is popular with the industry’s demand for higher levels of integration and lower cost. Our SiP technology is an ideal solution in markets that demand a smaller size with increased functionality. We have a proven track record as the industry leader in SiP design, assembly and test. These products are built in our state-of-the-art factory in Korea.

Packages for small form factor


System in Package


Double Sided Mold Package


Antenna in/on Package


Automotive Compute

Mobile solutions for 5G and wireless connectivity.

  • RFFE modules, AiP/AoP
  • Integration, shielding
  • Test, turnkey service
  • Supply chain management
  • Best-in-class manufacturing

Learn More about SiP RF

Quick to market using “off the shelf” components and industry-leading design rules.

  • Watch, earbuds, fitness, medical
  • Package miniaturization
  • Performance, high integration
  • Test, turnkey service

Learn More about SiP Wearables

High-performance solutions in a small footprint.

  • Infotainment, ECU, connectivity
  • IATF16949 certified
  • Test, turnkey service
  • Supply chain management

Learn More about SiP automotive


Contact an Amkor expert by clicking the request info button below.