The same benefits as MQFP, in a smaller package
Amkor offers a broad line of Low Profile Quad Flat Packages (LQFP) designed to provide the same benefits as a Thin Quad Flat Package (TQFP) with a 1.4 mm body thickness.
Amkor’s LQFP allows customers to focus on meeting requirements related to increasing board density, die shrink programs, thin end-product profile and portability. LQFP packages are ideal for most IC semiconductor technologies including microcontrollers and ASICs. These packages are valuable for electronic systems requiring broad performance characteristics. Applications include: PCs, video/audio, storage and communications, automotive and industrial controller ICs.
- 7 x 7 mm to 28 x 28 mm body size
- 1.4 mm body thickness
- 32–256 lead counts
- Copper leadframes
- Custom leadframe design available
- Broad selection of die pad sizes on open tooled leadframes
- Pb-free and RoHS compliant materials
Contact an Amkor expert by clicking the request info button below.