The same benefits as MQFP, in a smaller package

Amkor offers a broad line of Low Profile Quad Flat Packages (LQFP) designed to provide the same benefits as a Thin Quad Flat Package (TQFP) with a 1.4 mm body thickness.

Amkor’s LQFP allows customers to focus on meeting requirements related to increasing board density, die shrink programs, thin end-product profile and portability. LQFP packages are ideal for most IC semiconductor technologies including microcontrollers and ASICs. These packages are valuable for electronic systems requiring broad performance characteristics. Applications include: PCs, video/audio, storage and communications, automotive and industrial controller ICs.

Features

  • 7 x 7 mm to 28 x 28 mm body size
  • 1.4 mm body thickness
  • 32–256 lead counts
  • Copper leadframes
  • Custom leadframe design available
  • Broad selection of die pad sizes on open tooled leadframes
  • Pb-free and RoHS compliant materials

Questions?

Contact an Amkor expert by clicking the request info button below.