The same benefits as TQFP, in a smaller package

Amkor offers a broad line of LQFP (Low-profile Quad Flat Package) IC packages designed to provide the same great benefits as TQFP packaging with a 1.4 mm body thickness. These packages allow IC packaging engineers, component specifiers and systems designers to solve issues such as increasing board density, die shrink programs and thin end‑product profile.


  • 7 x 7 mm to 28 x 28 mm body size
  • 1.4 mm body thickness
  • 32–256 lead counts
  • Pre-plated frame options
  • Inverted pad configuration
  • Cu, Ag and Au wire available
  • Large selection of die pad sizes and custom leadframe design available
  • Optimal for stacked die
  • Pb-free and RoHS compliant materials


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