Value-added, low-cost packaging solutions

SSOP (Shrink Small-Outline Package) and QSOP (Quarter-Size Small Outline Package) are leadframe based, plastic encapsulated packages that are well suited for applications requiring optimum performance in IC packaging with compressed body size and tightened lead pitch. These industry-standard IC packages yield a significant reduction in size while running in high volume and provide value-added, low-cost solutions for a wide range of applications.


  • Cu wire interconnect for the lowest cost
  • Standard JEDEC package outlines
  • Multi-die production capability
  • Turnkey test services, including strip test options
  • Green materials are standard – Pb-free and RoHS compliant
  • Stealth dicing (narrow saw streets)
  • Larger/higher density leadframe strips
  • Leadframe roughing for improved MSL capability


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