Automotive Packaging – OSAT Market Challenges

From the May/June 2019 Issue of Chip Scale Review

Evolution of MEMS Devices and Effect on Packaging and Test

From the Apr. 2019 Issue of BW Businessworld

Heterogeneous Integration for a Connected World

From the Feb. 2019 Issue of IMAPS Microelectronics

An unrivaled global footprint

Corporate Headquarters

Factories

Sales Offices

Looking for technical information?

Data Sheets

Brochures

White Papers

Articles

Want to work at Amkor?

Amkor has great career opportunities around the world. Want to learn more? Choose your region below and take the next step to joining our team.

Latest Blog Posts

Semiconductor Tales: Materials for Packaging and Saving Cost, Vol. 2

Digital Life: Bezel-less, For Your Stylish Digital Life

Amkor Korea K4 Factory Manager Lihoon Kim is Appointed as the Honorary Customs Director of Gwangju Customs Office

Upcoming Events

China International Semiconductor Executive Summit

SiP Conference China 2019

CSPT 2019

Latest Press Releases