DSMBGA Package

Amkor’s Double Sided Molded Ball Grid Array (DSMBGA)

The most advanced & compact RF front-end modules

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MEMS & Sensor Solutions For Every Application

High volume, standard package platforms for custom solutions

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System in Package Solutions For Mobile & Wearable Applications

Advanced solutions for 5G and wireless connectivity

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Exploring the Challenges in 5G/6G Packaging

Amkor Technology Korea Shared Insight at the “Future Semiconductor Technology Roadmap” Event

Amkor and GlobalFoundries to Provide At-scale Semiconductor Test and Assembly Services in Europe

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