Automotive Packaging – OSAT Market Challenges
From the May/June 2019 Issue of Chip Scale Review
Evolution of MEMS Devices and Effect on Packaging and Test
From the Apr. 2019 Issue of BW Businessworld
Heterogeneous Integration for a Connected World
From the Feb. 2019 Issue of IMAPS Microelectronics
An unrivaled global footprint
Corporate Headquarters
Factories
Sales Offices
Looking for technical information?
Data Sheets
Brochures
White Papers
Articles
Want to work at Amkor?
Amkor has great career opportunities around the world. Want to learn more? Choose your region below and take the next step to joining our team.
Latest Blog Posts
Semiconductor Tales: Materials for Packaging and Saving Cost, Vol. 2
Digital Life: Bezel-less, For Your Stylish Digital Life
Amkor Korea K4 Factory Manager Lihoon Kim is Appointed as the Honorary Customs Director of Gwangju Customs Office
Upcoming Events
China International Semiconductor Executive Summit
SiP Conference China 2019
