Implement any packaging scheme with Wafer Level Packaging

Amkor offers a broad array of Wafer Level Packaging (WLP) capabilities and processes for packaging schemes from fan-out to chip scale to 3D to System-in-Package (SiP). Our advanced manufacturing operations in Korea, China, Taiwan, and Portugal are adjacent to major foundries, enabling the integration of factory logistics and reducing time-to-market.

The WLP family is applicable for a wide range of semiconductor device types while leveraging the smallest form factor and high performance from high-end RF WLAN combo chips, to FPGAs, power management, Flash/EEPROM, integrated passive networks and standard analog.

WLCSP

Enable higher semiconductor content in a high performing, small sized package

WLCSP+

The package solution for superior product robustness

WLFO

Flexibility to enable 3D multi-component package designs

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