This site uses cookies. By continuing to browse this site, you are agreeing to our use of cookies.
Find out more here.
X
English
한국어
日本語
简体中文
Document Library
Factory Certs
Investors
Web.data
Careers
Contact Us
MENU
About Us
Amkor Overview
Mission Statement
Company History
Leadership
Careers
China
France
Germany
Japan
Korea
Malaysia
Philippines
Portugal
Singapore
Taiwan
United States
Smart Manufacturing (I4.0)
Social Responsibility
News
Blog
Press Releases
Events
Customer Center
Amkor Mechanical Samples
B2B Integration Services
Document Library
Web.data
Investors
Memberships & Associations
Contact Us
Packaging
Laminate
CABGA/FBGA
FCBGA
fcCSP
FlipStack
®
CSP
Interposer PoP
PBGA/TEPBGA
Stacked CSP
Leadframe
ePad LQFP/TQFP
ePad TSSOP/SOIC/SSOP
LQFP
Micro
LeadFrame
®
MQFP
PLCC
PSOP
SOIC
SOT23/TSOT
SSOP/QSOP
TQFP
TSOP
TSSOP/MSOP
Power Discrete
D2PAK (TO-263)
DPAK (TO-252)
HSON8
LFPAK56
PowerCSP™
PQFN
PSMC
SO8-FL
SOD123-FL
SOD128-FL
TO-220FP
TOLL
TSON8-FL
Wafer Level
WLCSP
WLFO/WLCSP+
WLSiP/WL3D
Technology
2.5D/3D TSV
3D Stacked Die
AiP/AoP
Chip-on-Chip
Copper Pillar
Edge Protection™
Flip Chip
Interconnect
MEMS and Sensors
Optical Sensors
Package-on-Package
SWIFT
®
System in Package (SiP)
Test Solutions
Services
Design Services
Package Characterization
Wafer Bumping
Applications
Artificial Intelligence
Automotive
Communications
Computing
Consumer
Industrial
Internet of Things
Networking
Quality
Events
Come visit Amkor at the following tradeshows
and conferences
Home
|
Events
ISMP 2021
November 3, 2021
Road to Chiplets – Data & Test
November 9, 2021
CSIA-ICCAD 2021
November 11, 2021
TISES 2021
December 6, 2021
NEPCON Japan
January 19, 2022
