This site uses cookies. By continuing to browse this site, you are agreeing to our use of cookies. Find out more here.

X

English
한국어
日本語
简体中文

Document Library
Investors
Web.data
Contact Us

MENU

About Us
- Amkor Overview
- Mission Statement
- Company History
- Leadership
- Memberships & Associations
- Social Responsibility
- News
  - Blog
  - Press Releases
- Events
- Careers
  - China
  - France
  - Germany
  - Japan
  - Korea
  - Malaysia
  - Philippines
  - Portugal
  - Singapore
  - Taiwan
  - United States
- Investors
- Contact Us
Packaging
- Laminate
  - CABGA
  - FCBGA
  - fcCSP
  - FlipStack^® CSP
  - PBGA
  - Stacked CSP
- Leadframe
  - ePad LQFP/TQFP
  - ePad TSSOP
  - FusionQuad^®
  - LQFP
  - MicroLeadFrame^®
  - MQFP
  - PDIP
  - PLCC
  - PSOP
  - SOIC
  - SOT23/TSOT
  - SSOP
  - TQFP
  - TSOP
  - TSSOP
- Power Discrete
  - DPAK (TO-252)
  - HSON8
  - PSMC
  - SO8-FL
  - SOD123-FL
  - SOD128-FL
  - TO-220FP
  - TOLL
  - TSON8-FL
- Wafer Level
  - WLCSP
  - WLCSP+
  - WLFO
Technology
Services
Applications
Quality
Customer Center

Events

Come visit Amkor at the following tradeshows
and conferences

Home
|
Events

SEMICON Europa 2018

November 13, 2018

SemIsrael Expo 2018

November 27, 2018

ICCAD China 2018

November 29, 2018

Connect with us
Sign up for email updates from Amkor

© Copyright 2018 Amkor Technology

Careers|
Privacy Policy|
Legal|
Sitemap|
Contact Us|