China International Semiconductor Executive Summit

Amkor Technology is pleased to be part of the CISES 2019 event being held in Shanghai on September 5-6.

Amkorは次のプレゼンテーションを行います:

Sept 5 – 11:45-12:05 (Advanced Packaging Session)
Advanced Packaging: The Rise of Heterogeneous Integration“, Curtis Zwenger, VP, Adv Package & Technology Integration

Sept. 6 – 14:45-15:05 (Automotive Session)
Automotive Semiconductor Packaging – Where Are We Headed?“, Curtis Zwenger, VP, Adv Package & Technology Integration

Curtis Zwenger will also be a panelist during the panel discussion moderated by Merck on Friday, September 6 from 15:20-15:50.

The China International Semiconductor Executive Summit には、世界中から半導体業界のエグゼクティブたちが一堂に会し、大中華圏に関連する課題を討議します。

When: September 5, 2019 - September 6, 2019 開催地:中国、上海 Location: Grand Kempinski Hotel Shanghai

近日開催予定のイベント

TSES 2020

第22回 Electronics Packaging Technology Conference

CSIA – ICCAD 2020