China International Semiconductor Executive Summit

Amkor Technology is pleased to be part of the CISES 2019 event being held in Shanghai on September 5-6.

Curtis Zwenger, VP – Adv. Package & Technology Integration at Amkor will be present “Advanced Packaging: The Rise of Heterogeneous Integration” on Thursday, September 5 from 11:25-11:45

Curtis Zwenger will also be presenting the keynote on Friday, September 6 from 14:45-15:05.

The China International Semiconductor Executive Summit brings together semiconductor executives from around the world to discuss issues related to Greater China.

When: September 5, 2019 - September 6, 2019 Where: Shanghai, China Location: Grand Kempinski Hotel Shanghai


SiP Conference China 2019

NEPCON Nagoya 2019

European MEMS & Sensors Summit