China International Semiconductor Executive Summit
Amkor Technology is pleased to be part of the CISES 2019 event being held in Shanghai on September 5-6.
Curtis Zwenger, VP – Adv. Package & Technology Integration at Amkor will be present “Advanced Packaging: The Rise of Heterogeneous Integration” on Thursday, September 5 from 11:25-11:45
Curtis Zwenger will also be presenting the keynote on Friday, September 6 from 14:45-15:05.
The China International Semiconductor Executive Summit brings together semiconductor executives from around the world to discuss issues related to Greater China.