Our ongoing packaging research and development will provide answers to the technological challenges of future IoT products

Fueled by the rapid growth of the world-wide-web, people have become accustomed to a connected society. Now, the Internet of Things (IoT) provides the ultimate connectivity to objects. This includes wearables, connected (smart) cars, smart homes, smart cities, the Industrial Internet of Things (IIoT) and advanced medical/healthcare diagnostics and monitoring.


Amkor’s FCBGA, fcCSP, SiP, SSOP, SOIC, PBGA, MLF®, QFP and CABGA packages along with advanced WLCSP technology meet the design goals for high performance, integrated, efficient and cost-effective IoT end products.


Contact an Amkor expert by clicking the request info button below.