Our ongoing packaging research and development will provide answers to the technological challenges of future IoT products
Fueled by the rapid growth of the world-wide web, people have become accustom to a connected society. Now, the Internet of Things (IoT) provides the ultimate connectivity to objects. This includes: wearables, connected (smart) cars, smart homes, smart cities, the Industrial Internet of Things (IIoT) and advanced medical/healthcare diagnostics and monitoring.
Amkor’s FCBGA, fcCSP, SiP, SSOP, SOIC, PBGA, MLF®, QFP and CABGA packages along with advanced WLCSP technology meet the design goals for high performance, integrated, efficient and cost-effective IoT end products.
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