Leaders in wafer bumping and die-level interconnect technology

Amkor’s production certified wafer bumping processes and die level interconnect technology is unparalleled in the industry, offering reduced time-to-market with integrated factory logistics.

Amkor’s state-of-the-art wafer bumping capabilities in electroplated bumping and several types of Wafer Level Chip Scale Packaging (WLCSP) technologies are offered in strategic locations including: Korea, China, Portugal and Taiwan. These facilities are uniquely situated adjacent to major foundries to provide reduced time-to-market with integrated factory logistics and enables Amkor to provide complete turnkey flip chip and WLCSP solutions in these key geographic areas.

All Amkor facilities have world-class bumping lines with high-volume manufacturing production capability. Solder compositions including: 300 mm eutectic, 200 mm and 300 mm lead-free and Cu pillar (all low alpha) are production certified. The facilities also offer repassivation, and single- and multi-layer redistribution processes for both flip chip and WLCSP applications.

These facilities offer economy of scale as both plated bump (solder/CuP bump) and WLCSP/Wafer Level Fan-out (WLFO) continue to experience growth. Amkor’s combination of technology and manufacturing capabilities is unparalleled in the subcontract manufacturing industry.

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