Leading packaging technologies for computing ICs

Computing packages are found in both traditional desktop and mobile PCs including laptops and tablets. In contrast to increasing monolithic silicon integration, packaging engineers are continually being challenged to provide package-level integration for a variety of semiconductor technologies to achieve a comprehensive systems approach to computing.


Amkor’s FCBGA, fcCSP, SiP, SSOP, SOIC, PBGA, CABGA, MLF®, QFP, and other leading-edge packages address performance demands, as well as the thermal challenges of computing applications.


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