Our packaging and technology solutions address demanding challenges faced by automotive IC manufacturers
Automotive electronics encompasses a variety of products – from body electronics and access systems to engine, lighting and infotainment components. Amkor and J-Devices offer an industry-leading portfolio of automotive packaging technologies including:
- Low-Cost Flip Chip
- Wafer Level Chip Scale Packaging (WLCSP)
- System-in-Package (laminate and wafer-based)
- MEMS and Sensor
- Power Discrete
Amkor and J-Devices have extensive experience with automotive process requirements and have shipped billions of units for automotive applications. Our packages meet or exceed automotive quality, reliability, burn-in and safe launch plan criteria. Failure analysis, tri-temp test and statistical processes capabilities are in all factories.
Additional processes in place for automotive requirements include: specially trained personnel and dedicated production lines devoted to automotive applications meeting all quality certification requirements: IATF16949, ISO/TS16949, VDA6.3, AEC-Q100, AEC-Q101, APQP, PPAP.
Contact an Amkor expert by clicking the request info button below.