Our packaging and technology solutions address demanding challenges faced by automotive IC manufacturers

Automotive electronics encompasses a variety of products – from body electronics and access systems to engine, lighting and infotainment components. Amkor and J-Devices offer an industry-leading portfolio of automotive packaging technologies including:

  • Low-Cost Flip Chip
  • Wafer Level Chip Scale Packaging (WLCSP)
  • System-in-Package (laminate and wafer-based)
  • MEMS and Sensor
  • Leadframe
  • Power Discrete

 

Amkor and J-Devices have extensive experience with automotive process requirements and have shipped billions of units for automotive applications. Our packages meet or exceed automotive quality, reliability, burn-in and safe launch plan criteria. Failure analysis, tri-temp test, and statistical processes capabilities are in all factories.

Additional processes in place for automotive requirements include specially trained personnel and dedicated production lines devoted to automotive applications meeting all quality certification requirements: IATF16949, ISO/TS16949, VDA6.3, AEC-Q100, AEC-Q101, APQP, PPAP.

Questions?

Contact an Amkor expert by clicking the request info button below.