Our packaging and technology solutions address demanding challenges faced by automotive IC manufacturers

Automotive electronics encompasses a variety of products – from body electronics and access systems to engine, lighting and infotainment components. Amkor and J-Devices offer an industry-leading portfolio of automotive packaging technologies including:

  • Low-Cost Flip Chip
  • Wafer Level Chip Scale Packaging (WLCSP)
  • System-in-Package (laminate and wafer-based)
  • MEMS and Sensor
  • Leadframe
  • Power Discrete


Amkor and J-Devices have extensive experience with automotive process requirements and have shipped billions of units for automotive applications. Our packages meet or exceed automotive quality, reliability, burn-in and safe launch plan criteria. Failure analysis, tri-temp test and statistical processes capabilities are in all factories.

Additional processes in place for automotive requirements include: specially trained personnel and dedicated production lines devoted to automotive applications meeting all quality certification requirements: IATF16949, ISO/TS16949, VDA6.3, AEC Q-100, AEC Q-101, APQP, PPAP.


Contact an Amkor expert by clicking the request info button below.