Leadframe packages have long been an industry standard

Leadframe packages for almost every application:

  • Dual packages, common in memory, analog ICs and microcontrollers are found in consumer and automotive products. These packages provide an assortment of packaging capabilities, especially in low pin count devices, at competitive manufacturing costs.
  • Quad packages, extensively used in ASICs, digital signal processors (DSPs), microcontrollers and memory ICs, covers a wide range of open and closed tools offering low cost and reliable solutions for moderate and low pin count ICs.
  • MicroLeadFrame® QFN packages, plastic encapsulated near Chip Scale Package (CSP) with copper leadframe substrate, provides excellent thermal and electrical performance. This package is an ideal choice for any application where size, weight and performance are a factor.

ePad L/TQFP

Leadframe packaging for advanced application requirements

ePad TSSOP

Low-cost, thermal enhanced leadframe solution

FusionQuad®

Lower cost, thermally enhanced technology option

LQFP

The ideal package to meet high density requirements

MicroLeadFrame®

The right size, weight and performance for portable applications

MQFP

Designed to meet the challenges of advanced devices

PDIP

Packaging for easy board mounting

PLCC

Leadframe solutions for consumer to automotive applications

PSOP

Packaging for higher power devices

SOIC

Ideal packaging for reduced size and weight requirements

SOT23/TSOT

When saving space is important for devices requiring encapsulated packages

SSOP

Reliable packaging for applications requiring optimum performance

TQFP

Leadframe solution for stringent size requirements

TSOP

Plastic leadframe package for memory applications

TSSOP

High volume, value-added packaging solutions

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