Leadframe packages have long been an industry standard
Leadframe packages for almost every application:
- Dual packages, common in memory, analog ICs and microcontrollers are found in consumer and automotive products. These packages provide an assortment of packaging capabilities, especially in low pin count devices, at competitive manufacturing costs.
- Quad packages, extensively used in ASICs, digital signal processors (DSPs), microcontrollers and memory ICs, covers a wide range of open and closed tools offering low cost and reliable solutions for moderate and low pin count ICs.
- MicroLeadFrame® QFN packages, plastic encapsulated near Chip Scale Package (CSP) with copper leadframe substrate, provides excellent thermal and electrical performance. This package is an ideal choice for any application where size, weight and performance are a factor.
ePad LQFP TQFP
Leadframe packaging for advanced application requirements
ePad TSSOP MSOP SOIC SSOP
Low-cost, thermal enhanced leadframe solution
The ideal package to meet high density requirements
The right size, weight and performance for portable applications
Designed to meet the challenges of advanced devices
Leadframe solutions for consumer to automotive applications
Ideal packaging for reduced size and weight requirements
When saving space is important for devices requiring encapsulated packages
Reliable packaging for applications requiring optimum performance
Leadframe solution for stringent size requirements
Plastic leadframe package for memory applications
High volume, value-added packaging solutions