Leadframe Packages

Leadframe packages have long been an industry standard

Leadframe packages for almost every application:

• Dual packages, common in memory, analog ICs and microcontrollers are found in consumer and automotive products. These packages provide an assortment of packaging capabilities, especially in low pin count devices, at competitive manufacturing costs.
• Quad packages, extensively used in ASICs, digital signal processors (DSPs), microcontrollers and memory ICs, covers a wide range of open and closed tools offering low cost and reliable solutions for moderate and low pin count ICs.
• MicroLeadFrame^® QFN packages, plastic encapsulated near Chip Scale Package (CSP) with copper leadframe substrate, provides excellent thermal and electrical performance. This package is an ideal choice for any application where size, weight and performance are a factor.