If you can build it, Amkor can test it!

With the knowledge gathered from decades of supporting Tier 1 leaders and emerging industries, Amkor understands that test solutions must address advanced technology, quality, performance and cost of test. Through early engagement in each customer’s product lifecycle, Amkor helps define test strategies and intelligent equipment selection to provide differentiated test solutions.

Amkor’s comprehensive test services complement wafer level and package assembly. In addition, Amkor is the leading RF test services supplier for sub-6 GHz and is engaged in ongoing joint efforts with test equipment suppliers and customers to enable 5G product production testing. As the top OSAT supplier for automotive and artificial intelligence processor testing, we have an extensive array of test capabilities and significant experience in device testing.

  • 6-7 Billion units tested annually
  • 6-8 Million wafers tested annually
  • >2300 testers in 7 countries
  • Full end-of-line processing: Bake, scan, pack, ship and finished good services
  • Strip test: Leadframe, film frame, in-carrier
  • Test development: Software & hardware for probe, strip, final test and SLT
  • Testing for commercial, industrial & automotive devices
    • Discrete, power, mixed-signal, memory, RF, MEMS and System in Package (SiP) devices
  • Wafer probe, burn-in, final test, SLT

Test Equipment

Amkor has an extensive equipment fleet and continues to invest in new capabilities required to test the latest devices

Wafer Probe
Burn-in
Final
System Level
Backend

Testers

  • High-speed logic, mixed-signal, analog, high power and RF
  • Probe pin data rate & current densities, economical parallelism

Prober

  • Chuck planarity
  • Loading force
  • Position XY accuracy
  • Rotational angle
  • Temperature
  • Wafer Handling – 8” and 12” with 14, 10, 7 and 5 nm process technologies
  • Warped wafer (reconstituted wafers)

Probe Card

  • In-line cleaning; Overdrive
  • Multiple probe card technologies: Cantilever, vertical, pogo, membrane, MEMS & dual-level Chip-on-Wafer (CoW)
  • Number of touchdowns
  • Pin count per DUT; Pin-to-pin crosstalk; Per pin current capability
  • Pin field planarity; Alignment accuracy
  • Temperature tolerance

Burn-in Tester

  • High zone/chambers count
  • Max clock rate
  • Max I/O channel count
  • Max slot count
  • Product qualification & 100% burn-in support
  • Wide power range

Burn-in Board

  • DUT Power Delivery: All power application ICs supported
  • I/O & clock rates supported
  • Pin-to-pin Crosstalk: Minimal for most, if not all, applications
  • Socket config & features
    • Cost-sensitive socket, with pin depopulation & biasing
    • High temp tolerances

Burn-in Handler

  • Burn-in Board (BIB) loader/unloader

Burn-in Loader/Unloader (BLU)

  • All popular package types supported
  • High-efficiency input and output
  • Manual Component & BIB Loading/Unloading: Discouraged for higher volumes & 100% burn-in, in the interest of efficient cycle times

Tester

  • Dev Clock: PEC clock rate, differential clocks, low Jitter, levels
  • Dev I/O: At-speed functional test. Low- & high-speed data I/O differential buses. Peripheral Event Controller (PEC) channel count, levels, timing – low EPA, patterns, test & measurements
  • Dev Power: Device power supply – channel count, levels, ganging, source and measure, high accuracy
  • Dev RF & Analog I/O: RF source & measure FE with optimal Rx/Tx port count to allow max parallelism for max UPH; ADC/DAC – resolution, accuracy, dynamic range to allow testing the latest technologies
  • Optimal parallelism for max UPH

Load Board

  • PCB
  • PCB width
  • Per pin current capability
  • Pin-to-pin crosstalk
  • RFID monitoring for tooling
  • Temperature tolerance
  • Trace impedance

Test Contactor

  • Per pin current capability
  • Pin count per DUT
  • Pin field planarity
  • Pin-to-pin crosstalk/isolation/shielding
  • Temperature tolerance

Handler

  • Auto temperature control/thermal soak
  • DUT rotation
  • Footprint
  • Loading force
  • Loader speed
  • Package handling
  • Position XY accuracy

System Level Tester

  • Dev Clock Rate: High
  • Dev I/O: Max slot count, max I/O channel count
  • Dev Power: Range ultra-low, low, medium, high, rail count
  • Max units per hour

System Level Test Board

  • DUT Power delivery – all power application ICs supported
  • I/O & clock rates supported
  • Pin-to-pin crosstalk – minimal for most, if not all applications
  • Socket configurations & features
    • Cost-sensitive socket, with pin depopulation & biasing
    • High temp tolerances

System Level Handler

  • High test pattern zone count
    • Product qualification & 100% support
  • System Level Load/Unloader
    • All popular package types supported
    • High efficiency I/O
  • Temp controllers – low temp soak overhead times

Fully Customizable Backend Processes

  • Post marking is optional and bake is determined based on moisture sensitivity level (MSL)
  • For small turret handler packages, the final test, scan and tape & reel  packing is done sequentially

Advanced Solution for Advanced Packing

  • Package-on-Package (PoP)
  • Through Silicon Vias (TSV)
  • Flip Chip CSP (fcCSP)
  • Flip Chip BGA (FCBGA)

 

Test Locations

Our sites are strategically located near leading foundries, major customer sites and co-located to support probe with bump/WLCSP and test with assembly

China
Japan
Korea
Malaysia
Philippines
Portugal
Taiwan

Offerings

  • Bumping, film frame test, package test, system level test, test development, wafer probe

Test Equipment

  • 93K, FLEX, J750, Magnum, T5XXX, UFLEX

Packages

  • Flip Chip, CSP, MicroLeadFrame®, PBGA, WLCSP

Markets

  • Communications and Memory

Offerings

  • Package test, test development, wafer probe

Test Equipment

  • 93K, FLEX, J750, Magnum, T2K, T65XX, UFLEX

Packages

  • Flip Chip, PBGA, QFN

Markets

  • Automotive, communication and memory

Offerings

  • Bumping, film frame test, package test, system level test, test development, wafer probe

Test Equipment

  • 93K, FLEX, J750, T2K, T55XX, UFLEX

Packages

Markets

  • Automotive, communication and consumer

Offerings

  • Package test

Test Equipment

  • CATS, ITS, TESEC, Tsuruga

Packages

  • SO8-FL, SONXXX-FL, TO-220FP, TQFP, TSON-FL

Markets

Offerings

  • Burn-in, film frame test, MEMS test, package test, system level test, wafer probe

Test Equipment

  • 93K, ASLX, D10, ETS, FLEX, J750, LTX, Magnum, T2K

Packages

  • MicroLeadFrame®, QFP, and other leadframes

Markets

  • Automotive, consumer, and memory

Offerings

  • Test development, wafer probe

Test Equipment

  • Rack & stack, T55XX, UFLEX RF

Packages

  • WLCSP, WLFO

Markets

  • Communication and memory

Offerings

  • Bumping, film frame test, package test, wafer probe

Test Equipment

  • 93K, ETS, FLEX, J750, LTX, STS, T2K, T6XXX, UFLEX

Packages

  • Flip Chip, WLCSP

Markets

  • Communication, consumer and networking

Test Development Engineering

A fraction of the customers develop their own complete test solutions and offload to Amkor for production. Amkor can enable co-development, or full development, of complete test software and hardware solutions. Engage with us early in the product design for maximum impact or come to us later in the product lifecycle for significant cost savings with migrations to more cost-effective testers and/or higher parallelism.

Typical Test Development Cycle Times

 

Differentiated Test By Market

Automotive & Industrial

Amkor is the number one automotive OSAT, supporting worldwide supply chains. Products in this area include infotainment and safety requiring high levels of performance. This requires a much more comprehensive set of test requirements.

  • Cold wafer probe and perform room & hot temperature final test
  • High-quality, standards-compliant processes and systems
  • Inspections and tri-temperature multi-temperature test capabilities
    • Burn-in
    • Final test at -55°C to +175°C
    • System Level Test (SLT)
    • Wafer probe at -55°C to +200°C
  • Post assembly final test with outgoing post assembly opens/shorts testing, includes 2 and 4 wire resistance tests
Communications

Over 38% of Amkor’s revenue is derived from Communications (smartphones, tablets, handhelds and wearable devices). Our leading-edge test solutions keep pace with rapid changes in cellular and connectivity technology requirements. Amkor is already well-positioned for 5G wireless and its new test requirements working with leading customers and ATE suppliers, we have 5G RF test capability in place.

  • Asynchronous test for different RF connectivity standards
  • ATE coverage with SLT (protocol test)
  • ATE w/32 port and multi-site, multi-channel Tx & Rx support
  • Complex SiP with simple SLT, including RF callbox testing
  • Local RF shielding ≤60 dBm
  • Multi-site x8 RF test to lower cost
  • RF Front End (RFFE), SiP & IoT
  • RF wafer probe capabilities – known good die (KGD) for WLCSP and known tested die (KTD) for SiP
  • Single and multiple channel beamforming, phased array, AiP/AoP support
  • SoC + Memory PoP – double side test/stack CSP – memory and logic test
Artificial Intelligence, Networking & Computing

Amkor is a leading provider of high-performance test solutions for the demanding networking and computing market – where five nines (99.999%) or higher uptime is expected. We have multiple customers supplying SiP(s), SoC(s) and components into these markets (servers, routers, switches, PCs, laptops and peripherals). Integral to these markets are storage technology and migrations from hard disk drives to solid-state drives (SSD). In addition, Amkor has a strong array of NAND test capabilities.

  • Active thermal control for 300-watt products across tri-temperature in SLT and ATE test
  • Distributed test (wafer probe, in-situ test between key assembly steps and final test (SLT and ATE) for 2.5D)
  • Dynamic burn-in
  • Film frame and strip test (x308 EEPROM)
  • High-speed serial digital (e.g. PCIe Gen4, Gen5) testing up to 16 Gbps and 32 Gbps
  • Probe solutions and wafer map management for Chip on Wafer (CoW)
  • Test during burn-in (TDBI)
Power/Discretes

Amkor is a world leader in power discrete devices, with test services that are closely integrated with assembly flow for shorter cycle times and reduced costs. Unique requirements include:

  • Adequate thermal capacity
  • High current, high voltage
  • Kelvin contact-type tests
  • Low Rds_on

High-volume products at Amkor include:

  • Diodes
  • Flip chip MOSFETs
  • Intelligent power modules
  • Insulated-Gate Bipolar Transistors (IGBT)
  • Multi-voltage FETs
  • Regulators and bipolar transistors for the automotive, power transmission and industrial segments
Sensors & Actuators (MEMS)

Products for today’s Internet of Things (IoT) and Industrial Internet of Things (IIoT) require an MCU, RF transmitter/receiver, sensors and actuators. The test solution needs to cover the conversion of physical real-world analog signals into electrical data and processing of the data to determine if the product is good or not.

Test Packages

2.5D/3D
AiP/AoP
Bumped Wafer
MCM
SiP
Stacked

Operations

  • Interim process test/SLT
  • O/S, KGD/Interposer, TSV test
  • Package final test/SLT

Test Solution

  • C/P: 50 µm pitch, >20K needles, >100A, tri-temp
  • F/T: Tri-temp, ATC 300W
  • O/S: 2/4 wires Kelvin
  • SLT: 12 sites, ATC 300W

Current Products

  • Logic + Memory + Si Interposer, 3D TSV HBM, HMC
  • Mobile AP, CPU, GPU
  • Networking, server

Operations

  • Burn-in
  • Final test
  • System level test

Test Solution

  • Contactor waveguide design
  • Firmware based PC test
  • Multi-channel RF connectivity standards
  • SLT handler for RF callbox test

Current Products

  • Flip chip Tx/Rx @ 24/52 GHz for mmWave
  • Qualified BOM in HVM for fcCSP for WiGig (60 GHz)
  • RF Front-end module
  • WLFO Qualified for 60/77 GHz reader applications

Operations

  • Copper Pillar (CuP) bump probe test at 125°C
  • Hot & cold test capabilities

Test Solution

  • All ATE varieties
  • Probe cards to match the product’s functional requirements
  • Warpage handling prober

Current Products

  • Automotive radar transceivers/receivers, pressure sensors and network switches
  • RF tuners, baseband, transceivers, switches, PMIC, GPU
  • WLCSP, WLFO, CuP, leadframe bump, CoW, SiP, CoC, 2.5D/3D TSV

Operations

  • 2.5D Interposer test
  • Final test (ASIC + HBM)
  • KGD Interim test – ASIC

Test Solution

  • Active thermal control >100W
  • Advanced test option required – high current >50A/high pin count >2000
  • Large body

Current Products

  • 2.1D advanced MCM
  • AI, GPU, FPGA
  • Automotive
  • FCBGA structure – flip chip multi-chip/SiP module
  • Networking & server

Operations

  • Fully functional and SLT test steps

Test Solution

  • Asynchronous test for different RF connectivity standards
  • Contactor design for module test
  • Firmware based PC test
  • Slot based SLT handler for massively parallel test

Current Products

  • Advanced SiP, PoP, DSBGA, stacked die, Package in Package (PiP), cavity, Face-to-Face (F2F) and others
  • Automotive/PMIC/MEMS/EMI shield/IPD
  • RF Front-end module

Operations

  • SOC + Memory PoP
    • Double side test/stack CSP
    • Memory & logic test

Test Solution

  • Memory interface test through logic or modem die
  • Memory test at SLT and memory fuse blow through logic die
  • Top/bottom socket

Current Products

  • Fine pitch TMV®/Interposer PoP
  • Mobile AP & BB PoP
  • Mobile modem & memory stack CSP

Questions?

Contact an Amkor expert by clicking the request info button below.