Plastic leadframe package for tight space requirements

TSSOPs (Thin-Shrink Small Outline Packages) and MSOPs (Micro Small Outline Packages) are leadframe-based and plastic encapsulated, suited for applications requiring 1 mm or less mounted height. TSSOPs/MSOPs are industry standard and run in very high volume. They provide a value-added, cost-effective solution for a wide range of applications. New developments include larger/higher density leadframe strips and leadframe roughening for improved Moisture Sensitivity Level (MSL) capability.


  • Cu wire interconnect for low cost
  • Standard JEDEC package outlines
  • Multi-die production capability
  • Turnkey test services, including strip test options
  • Available in ExposedPad configuration


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