Plastic leadframe package for tight space requirements
TSSOP (Thin Shrink Small Outline Package) and MSOP (Mini Small Outline Package) are leadframe based, plastic encapsulated packages that are well suited for applications requiring less than 1 mm mounted height. These industry-standard packages run in very high volume and provide a value-added, low-cost solution for a wide range of applications.
Features
- Cu wire interconnect for lowest cost
- Standard JEDEC package outlines
- Multi-die production capability
- Turnkey test services, including strip test options
- Available in ExposedPad configuration
- Green Materials are standard – Pb-free and RoHS compliant
- Stealth dicing (narrow saw streets)
- Larger/higher density leadframe strips
- Leadframe roughening for improved MLS capability
Questions?
Contact an Amkor expert by clicking the request info button below.