More than 40 years of power discrete packaging experience
Let Amkor put more than 40 years of experience in power discrete packaging to work for your application. We serve a wide range of markets from automotive to communications and industrial.
Optimized for power sensitive and mobile applications, Amkor’s high-performance power devices include advanced power packaging, advanced copper clip attach and modules. With technology focused on electrical and thermal improvement, these packages primarily use wirebond interconnect technology using a leadframe as the package carrier. Most of our offerings also use a copper clip interconnect, providing the best known electrical properties for power devices.
A small footprint with enhanced thermal performance
The solution for high efficiency diodes and transistors
Improved power dissipation in a thinner package
The solution for compact surface mount packaging
Power discrete for high-efficiency diode applications
The power discrete with enhanced thermal properties
For medium to high voltage MOSFETs and IGBTs
Configured for surface mount applications
Reduced footprint with the maximum permissible power dissipation capability