More than 40 years of power packaging experience

Amkor’s power packages are optimized to enable a wide range of applications, meeting market demands from automotive to communications to industrial. Enhanced for power-sensitive and mobile applications, our high-performance power devices include innovative packaging, advanced copper clip attach and modules.

Amkor’s experienced engineering team delivers full turnkey services, including test, for all power products. Let us put more than 40 years of experience and innovation in power packaging to work for your application!

DPAK (TO-252)

Configured for surface mount applications

D2PAK (TO-263)

Suitable for high power applications

HSON8

A small footprint with enhanced thermal performance

LFPAK56

The solution for key automotive applications

PowerCSP™

Electrical and thermally-enhanced power package

PQFN

Designed for low on-resistance and high-speed switching MOSFETs

PSMC

The solution for high efficiency diodes and transistors

SO8-FL

Improved power dissipation in a thinner package

SOD123-FL

The solution for compact surface mount packaging

SOD128-FL

Power discrete for high-efficiency diode applications

TO-220FP

For medium to high voltage MOSFETs and IGBTs

TOLL

Designed for use in advanced automotive applications

TSON8-FL

Reduced footprint with the maximum permissible power dissipation capability

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