More than 40 years of power discrete packaging experience
Let Amkor put more than 40 years of experience in power discrete packaging to work for your application. We serve a wide range of markets from automotive to communications and industrial.
Optimized for power sensitive and mobile applications, Amkor’s high-performance power devices include advanced power packaging, advanced copper clip attach and modules. With technology focused on electrical and thermal improvement, these packages primarily use wirebond interconnect technology using a leadframe as the package carrier. Most of our offerings also use a copper clip interconnect, providing the best known electrical properties for power devices.
Configured for surface mount applications
Suitable for high power applications
A small footprint with enhanced thermal performance
The solution for key automotive applications
Electrical and thermally-enhanced power package
Designed for low on-resistance and high-speed switching MOSFETs
The solution for high efficiency diodes and transistors
Improved power dissipation in a thinner package
The solution for compact surface mount packaging
Power discrete for high-efficiency diode applications
For medium to high voltage MOSFETs and IGBTs
Designed for use in advanced automotive applications
Reduced footprint with the maximum permissible power dissipation capability