More than 40 years of power discrete packaging experience

Let Amkor put more than 40 years of experience in power discrete packaging to work for your application. We serve a wide range of markets from automotive to communications and industrial.

Optimized for power sensitive and mobile applications, Amkor’s high-performance power devices include advanced power packaging, advanced copper clip attach and modules. With technology focused on electrical and thermal improvement, these packages primarily use wirebond interconnect technology using a leadframe as the package carrier. Most of our offerings also use a copper clip interconnect, providing the best known electrical properties for power devices.

DPAK (TO-252)

Configured for surface mount applications

HSON8

A small footprint with enhanced thermal performance

PSMC

The solution for high efficiency diodes and transistors

SO8-FL

Improved power dissipation in a thinner package

SOD123-FL

The solution for compact surface mount packaging

SOD128-FL

Power discrete for high-efficiency diode applications

TO-220FP

For medium to high voltage MOSFETs and IGBTs

TSON8-FL

Reduced footprint with the maximum permissible power dissipation capability

TOLL

Designed for use in advanced automotive applications

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