Small and efficient packages

ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based, plastic encapsulated packages that are well suited for applications requiring optimum thermal performance, compressed body size and tightened lead pitch. These industry-standard IC packages offer a substantial increase in heat dissipation, yield a significant reduction in size and provide value-added, low-cost solutions for a wide range of applications. A green BOM is standard, allowing devices to meet applicable Pb-free and RoHS standards.


  • Cu wire interconnect for the lowest cost
  • Standard JEDEC package outlines
  • Multi-die production capability
  • Turnkey test services, including strip test options
  • ExposedPad configuration for increased thermal efficiency
  • Up to 60% improvement in Theta JA (compared to standard TSSOP or SOIC)
  • Green materials are standard – Pb-free and RoHS compliant
  • Stealth dicing (narrow saw streets)
  • Larger/higher density leadframe strips
  • Leadframe roughening for improved MSL capability


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