Small and efficient packages

ExposedPad (ePad) TSSOP, MSOP, SOIC & SSOP are leadframe based, plastic encapsulated packages suited for applications requiring optimal thermal performance, compressed body size and tightened lead pitch. ePad Thin-Shrink Small Outline Package, Micro Small Outline Package, Small Outline Integrated Circuit and Shrink Small Outline Packages (TSSOP, MSOP, SOIC & SSOP) offer a substantial increase in heat dissipation, yield a significant reduction in size and provide value-added, low-cost solutions for a wide range of applications. New developments include stealth dicing (narrow saw streets), larger/higher density leadframe strips and leadframe roughening for improved Moisture Sensitivity Level (MSL) capability.

Features

  • Cu wire interconnect for lowest cost
  • Standard JEDEC package outlines
  • Multi-die production capability
  • Turnkey test services, including strip test options
  • ExposedPad configuration for increased thermal efficiency
  • Up to 60% improvement in Theta JA (compared to standard TSSOP or SOIC)

Questions?

Contact an Amkor expert by clicking the request info button below.