Small and efficient packages
ExposedPad (ePad) TSSOP, MSOP, SOIC & SSOP are leadframe based, plastic encapsulated packages suited for applications requiring optimal thermal performance, compressed body size and tightened lead pitch. ePad Thin-Shrink Small Outline Package, Micro Small Outline Package, Small Outline Integrated Circuit and Shrink Small Outline Packages (TSSOP, MSOP, SOIC & SSOP) offer a substantial increase in heat dissipation, yield a significant reduction in size and provide value-added, low-cost solutions for a wide range of applications. New developments include stealth dicing (narrow saw streets), larger/higher density leadframe strips and leadframe roughening for improved Moisture Sensitivity Level (MSL) capability.
- Cu wire interconnect for lowest cost
- Standard JEDEC package outlines
- Multi-die production capability
- Turnkey test services, including strip test options
- ExposedPad configuration for increased thermal efficiency
- Up to 60% improvement in Theta JA (compared to standard TSSOP or SOIC)
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