The development of Artificial Intelligence (AI) systems is creating an opportunity for new semiconductor devices
As technologies continue to evolve, there is a need for flexible designs and support for this fast-growing market segment. With its broad portfolio and extensive experience across markets, Amkor has the capability to help customers make a big impact with AI solutions.
One of the fastest-growing AI-related growth applications is the automotive market, particularly for advanced driver assistance systems and electric vehicles. Smart home solutions are another, which includes voiced-based virtual personal assistants based on AI systems.
Amkor provides IC packaging for these various AI applications in the form of advanced 3D and stacked die packages and wafer level packaging with techniques such as Through Silicon Via (TSV) and Through Mold Via (TMV®) interconnects to solve the size and power consumption challenges.
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