Amkor ESG Report Tile

Amkor Releases Its Environmental, Social and Governance Report

Enabling a Sustainable Future Through Our ESG Initiatives

Link to 2.5D TSV Blog

Amkor Technology Expands 2.5D TSV Capacity

Our 2.5D TSV has been pivotal in advancing AI applications

Rendering of ATA facility

Amkor Announces US Advanced Packaging and Test Facility

Enabling a resilient domestic semiconductor supply chain

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Latest Blog Posts

3DInCites Interviews Amkor’s Brendan Wells at the IMAPS International Symposium 2024

Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona

Revolutionizing IC Packaging with S-SWIFT™ Technology

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