Offering design flexibility for medium power applications

Amkor’s HSON8 package is optimized for medium power applications designed for low on-resistance and high-speed switching MOSFETs, found in motor drivers, injection drivers, power supply circuits, lamp drivers and automotive products.

For design flexibility, the HSON8 power discrete package maintains the same 5 x 6 mm footprint area as the standard SOP8 package. To enhance thermal performance, it features an exposed die pad.

Features

  • Al wire bonding
  • Plating coverage at the tip of the lead is more than 50% of leadframe thickness
  • Full turnkey available from wafer probe through test and packing
  • Green materials: Pb-free plating and halogen-free mold compound

Questions?

Contact an Amkor expert by clicking the request info button below.