Offering design flexibility for medium power applications

The HSON8 package is optimized for medium power applications designed for low on-resistance and high-speed switching MOSFETs, found in motor drivers, injection drivers, power supply circuits, lamp drivers and automotive products. For design flexibility, the HSON8 power discrete package maintains the same 5 x 6 mm footprint area as the standard SOP8 package. To enhance thermal performance, it features an exposed die pad.


  • Al wire bonding
  • Plating coverage at the tip of the lead is more than 50% of the leadframe thickness
  • Full turnkey available from wafer probe through test and packing
  • Green materials: Pb-free plating and halogen-free mold compound


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