Amkor helps customers meet the increasing performance demands of today’s network systems
Amkor offers packaging solutions with the high-power density and low-power consumption required. Data centers, cell towers, fiber optics gear and more provide the networking infrastructure for modern communications. Specific hardware aspects of a network include servers, data storage infrastructure and solid-state drives (SSDs).
A data center’s server and storage hardware must be available 24 hours a day, 7 days a week, while optimizing energy efficiency. Enterprise-level SSDs must meet reduced size and improved heat dissipation/power consumption design requirements. IC technologies in networking provide switches, processors, controllers, PHY, logic, analog, power management, clocks, memory, and sensors.
Amkor provides IC packaging for a variety of technologies in the form of BGA, fcCSP, SiP, SSOP, SOIC, PBGA, CABGA, MLF®, and QFP packages. Amkor’s advanced 3D and stacked die packages and wafer-level packaging with techniques such as Through Silicon Via (TSV) and Through Mold Via (TMV®) interconnect can solve the size and power consumption challenges confronting network design engineers.
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