Low-profile leadframe packaging

Amkor’s Thin Small Outline Package (TSOP) is a leadframe-based, plastic encapsulated package suited for memory products, including SRAM, FLASH, FSRAM and EEPROMs.

Features

  • Cu or Ag wire interconnect for low cost
  • Standard JEDEC package outlines
  • Enhanced design for memory applications
  • Stacked die up to 4X, including stair step and Film-over Wire (FoW) construction
  • Turnkey test services, including strip test options

Questions?

Contact an Amkor expert by clicking the request info button below.