Lightweight and thin package solution

Amkor’s broad line of Thin Quad Flat Packages (TQFPs) is well suited for customers that require reliable, cost-effective packages that are well established in the semiconductor industry. A wide range of body sizes and lead counts make this a versatile solution for many applications. TQFP packages are particularly valuable for applications requiring broad performance characteristics. Applications include computing, video/audio, gaming, data acquisition, office equipment, automotive, industrial, storage and communications.

TQFPs are ideal packages for most IC semiconductor technologies including DSPs, PLDs, microprocessors, PMIC controllers and ASICs. Amkor offers a broad selection of die pad sizes in open-tooled leadframes, as well as custom leadframe designs.


  • 5 x 5 mm to 20 x 20 mm body size
  • 32–176 lead counts
  • A broad selection of die pad sizes
  • Copper leadframes
  • 1.0 mm body thickness
  • Custom leadframe design available
  • Low-stress BOM for stress-sensitive products
  • Pb-Free and RoHS compliant


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