From prototype to production with Amkor’s ChipArray®/FBGA packages

Amkor’s ChipArray BGA (CABGA) laminate based packages are compatible with SMT mounting processes worldwide. The near chip size CABGA fine-pitch BGA (FBGA) offers a broad selection of ball array pitches (≥0.3 mm pitch), ball counts and body sizes (1.5 mm to 27 mm body), single and multi-die layouts, stacked die (1-16) and passive component integration. Thin core laminate (2 to 6 metal layer) from the strongest supply chain in the industry, ultra-thin mold cap thickness and Si thinning to 50 µm enable next generation tablets, smartphones, game controllers, automotive, industrial, digital and video cameras and remote devices.


  • Cutting edge technology and expanding package offerings provide a platform from prototype-to-production
  • Copper wire interconnect method and high volume infrastructure at all Amkor CABGA production facilities
  • Lowest cost using Amkor standard CABGA bill of materials selection
  • 1.5-27 mm body size available
  • Square or rectangle packages available
  • 4-700 ball/lead counts
  • 0.4, 0.5, 0.65, 0.75, 0.80 & 1.0 mm ball pitch available
  • JEDEC Publication 95 Design Guide 4.5 (JEP95)
  • RoHS-6 (green) BOM options for 100% of CABGA family
  • Thermal conductivity epoxy (8W/mk) and thermal conductivity compound (3W/mK) are available
  • Automotive AEC-Q100 Compliance


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