Exploring the Challenges in 5G/6G Packaging

July 14, 2023 in Semiconductor Story by Amkor Marcom

Millimeter wave (mmWave) frequencies are essential for transferring more data quickly, but they also require different packaging technology to minimize loss and drift. That opens up a number of tradeoffs around Antenna in Package (AiP), Antenna on Package (AoP), flexible circuits, and different substrates.

Curtis Zwenger, Vice President, Engineering and Technical Marketing at Amkor Technology, talks with Semiconductor Engineering about a host of new challenges ranging from over-the-air testing and cross-talk to impedance matching.