小型、高效封装

Amkor’s ExposedPad (ePad) TSSOP, MSOP, SOIC & SSOP are leadframe based, plastic encapsulated packages suited for applications requiring optimal thermal performance, compressed body size and tightened lead pitch. ePad Thin-Shrink Small Outline Package, Micro Small Outline Package, Small Outline Integrated Circuit and Shrink Small Outline Packages (TSSOP, MSOP, SOIC & SSOP) offer a substantial increase in heat dissipation, yield a significant reduction in size and provide value-added, low-cost solutions for a wide range of applications. New developments include stealth dicing (narrow saw streets), larger/higher density leadframe strips and leadframe roughening for improved Moisture Sensitivity Level (MSL) capability.

特色

  • Cu wire interconnect for the lowest cost
  • 标准 JEDEC 封装外形
  • 多晶粒制造能力
  • 一站式测试服务、包括条带测试选项
  • ExposedPad 配置以提高热效率
  • 最高将 θ JA 提升 60%(相对于标准 TSSOP 或 SOIC)

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