市面上最齐全的倒装芯片封装
解决方案

Amkor is committed to being the leading provider of Flip Chip in Package (FCiP) technology. By partnering with proven industry leaders, Amkor has brought high volume flip chip packaging and assembly to the subcontract market. FCBGA, fcLBGA, fcLGA, FlipStack® CSP and fcCSP packages are qualified and in production. Flip chip production capability exists in our Portugal, Philippines, Korea, Taiwan, and China factories. Wafer bumping, wafer level packaging (WLP) and flip chip packaging solutions are qualified in lead-free options.

倒装芯片互连为用户提供大量可能的优点:

  • Reduced signal inductance – Because the interconnect is much shorter in length (0.1 mm vs. 1–5 mm), the inductance of the signal path is greatly reduced. This is a key factor in high-speed communication and switching devices
  • Reduced power/ground inductance – By using flip chip interconnect, power can be brought directly into the core of the die, rather than requiring rerouting to the edges. This greatly decreases the noise of the core power, improving the performance of the silicon
  • 缩小晶粒尺寸—针对受焊盘限制的晶粒(尺寸由焊盘所需边缘空间确定),晶粒的尺寸可以被缩小,从而节约硅的成本

  • Higher signal density – Rather than edge only, the entire surface of the die can be used for interconnect. This is similar to the comparison between QFP and BGA packages. Because flip chip can connect over the surface of the die, it can support larger numbers of interconnects on the same die size
  • 缩减封装面积—在部分情况下,倒装产品可以缩小整体封装面积。这一点通过降低晶粒到封装的边缘空间要求(因为无需为焊线预留空间)或采用更高密度的基板技术,进而缩短封装节距得以实现

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