满足高性能、低能耗需求

Through Silicon Via (TSV) interconnects have emerged to serve a wide range of 2.5D TSV and 3D TSV packaging applications and architectures that demand very high performance and functionality at the lowest energy/performance metric. To enable the use of TSVs in 2.5D/3D TSV architectures, we have developed several back-end technology platforms to enable high volume processing of TSV-bearing wafers and assembly. Amkor’s TSV wafer process begins with 300 mm wafers which have TSVs already formed. Our wafer process thins the wafers and creates backside (BS) metallization to complete the TSV interconnection. The TSV reveal and back side metallization process flow is commonly referred to as Middle-End-Of-Line (MEOL). Amkor does not provide TSV formation in foundry wafers.

Amkor 的 MEOL 制造工具和工艺包括:

  • 晶圆支持焊接和拆焊
  • TSV 晶圆减薄
  • TSV 露出和 CMP
  • 背面钝化
  • 在必要时重新布线
  • 微柱无铅电镀和 C4 互连
  • 适用于 TSV 产品的晶圆级探针和中期组装测试

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