适用于中压电源应用的功率离散封装

Amkor’s DPAK (TO-252) package follows the JEDEC standard and is configured for surface mount applications. The DPAK package is suitable for medium power applications designed for low on-resistance and high-speed switching MOSFETs such as motor drivers, power supply circuits, DC-DC converters, consumer and automotive products.

特色

  • 采用粗铝焊线,以实现低导通电阻与高电流密度
  • 从晶圆探针到测试与封装的一站式服务
  • 绿色材料:无铅电镀和无卤素模塑化合物

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