更小、更薄、更轻的封装解决方案

Amkor is a world leader in Wafer Level Fan-Out (WLFO), the fastest-growing packaging technology on the market today. This advanced packaging platform is also considered to have the most potential for applications requiring small-form factors in x, y, and z (low package height), tight transmission loss requirements or high-performance demands.

借助于我们的有效大容量生产能力,Amkor 已完成交付超过 12 亿件 WLFO 封装(截止至 2017 年11 月),达到行业水平成品率,并完全符合 JEDEC 和 AEC-Q100(1 级)的质量/可靠性要求。

WLFO 的优点包括,由于采用无基板设计,其灵活性能够在机械、电气和热力层面实现 3D 多元件封装设计 (WL3D) 和出色的性能。该更小、更薄、更轻的封装还能兼容行业内最高的商业集成密度。

WLFO enables flexible System in Package (WLSiP) and heterogeneous integration packaging solutions in 2D (side-by-side) and 3D constructions (WL3D). Its superior electrical and thermal performance is due to shorter and more precise interconnections, as well as reduced material layers, which are especially recommended for very high-frequency applications. WLFO is a RoHS and REACH compliant packaging technology.

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