克服复杂的 3D 封装挑战

Since 1998, Amkor Technology has been a pioneer in developing and providing high volume, low-cost 3D packaging technologies. Our development through deployment approach transcends the range of applications and packaging platforms requiring 3D technology. Customers benefit from this approach as new 3D packaging solutions are more effectively qualified and ramped to high volume, at low cost, and across multiple factories.

重要的 3D 平台技术包括:

  • 适用于更轻薄、高密度基板技术的设计规则和基础设施
  • 先进的晶圆减薄和处理系统
  • 更轻薄的晶粒贴装和晶粒堆叠工艺
  • 高密度和小线弧焊线
  • 无铅及环保绿色材料组合
  • 倒装芯片和焊线混合技术堆叠
  • 一站式晶粒和封装堆叠组装与测试流程

晶粒堆叠

Amkor’s die stacking technologies are widely deployed in high volume manufacturing across multiple factories and product lines. Next generation die stacking technology includes the ability to handle wafers and die thinned down to below 35 µm. It can be reliably stacked and interconnected with up to 16 active devices high, employing leading-edge die attach, die spacing, wire bond, and flip chip assembly capabilities.

Die stacking technologies have been demonstrated up to 24 high stacks, however, most stacks greater than 9 devices high use a combination of die and package stacking technologies to address complex test, yield, and logistic limitations.

Die stacking is also widely deployed in conventional leadframe-based packages including QFP, MLF®, and SOP formats. Leveraging Amkor’s industry-leading infrastructure for high volume, low-cost leadframe production, system designations can achieve significant savings in printed circuit board real estate and overall cost.

封装堆叠

Amkor 在完全组装和测试封装堆叠方面提供具有重要意义的创新,以克服与复杂晶粒堆叠相关的技术、业务和后勤限制。Amkor 的先进层叠封装 (POP) 解决方案包括:

底部可堆叠极小节距 BGA (PSvfBGA) 采用焊线或混合(FC 和焊线)堆叠支持单晶粒和堆叠晶粒,它被运用于倒装芯片 (FC) 应用以通过测试和 SMT 处理改善翘曲控制和封装完整性。

底部可堆叠倒装芯片芯片尺寸封装 (PSfcCSP) 在 fcCSP 组装流水线上采用集成 PSvfBGA 封装堆叠设施特点的外露式晶粒底部封装。PSfcCSP 的薄型外露式 FC 晶粒实现 0.5 毫米节距的小节距堆叠接口,它是中心模塑 PSvfBGA 结构的挑战之一。

穿塑通孔 (TMV®) 是我们的新一代 POP 解决方案,它的互连通孔穿透模塑盖。TMV 技术提供稳定的底部封装,让使用更大晶粒/封装比的更轻薄基板成为可能。TMV PoP 可以支持单晶粒、堆叠晶粒或 FC 设计。此封装是适用于新兴 0.4 毫米节距低功耗 DDR2 和 DDR3 的理想解决方案,能够满足储存器的接口要求。另外,TMV 还能使堆叠接口兼容密度为 0.3 毫米及更小的焊球节距。

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