低成本的热性能优化封装

Amkor’s PLCC (Plastic Leaded Chip Carrier) package offerings cover the total range of industry-available options, including 20 to 84 lead square body packages as well as the 32 lead rectangular body format. RoHs compliant, lead-free and green materials are now Amkor qualified standards for this package family. Amkor’s PLCC product family is engineered to meet JEDEC requirements for “J” leaded surface-mount packages. This package is used for a wide variety of device types, including microcontrollers, ASICs, power controllers, etc. Typical applications include consumer and industrial products.

特色

  • Body sizes from 0.352” x 0.352” to 1.152” x 1.152”
  • 20-84 个引脚数量
  • 符合 JEDEC 标准外形
  • 小节距焊线功能

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