작고 효율적인 패키지
Amkor’s ExposedPad (ePad) TSSOP, MSOP, SOIC & SSOP are leadframe based, plastic encapsulated packages suited for applications requiring optimal thermal performance, compressed body size and tightened lead pitch. ePad Thin-Shrink Small Outline Package, Micro Small Outline Package, Small Outline Integrated Circuit and Shrink Small Outline Packages (TSSOP, MSOP, SOIC & SSOP) offer a substantial increase in heat dissipation, yield a significant reduction in size and provide value-added, low-cost solutions for a wide range of applications. New developments include stealth dicing (narrow saw streets), larger/higher density leadframe strips and leadframe roughening for improved Moisture Sensitivity Level (MSL) capability.
- Cu wire interconnect for the lowest cost
- 표준 JEDEC 패키지 규격
- Multi-die 어셈블리 생산 능력
- Turnkey test services, including strip test options
- ExposedPad configuration for increased thermal efficiency
- 열 저항의 최대 60% 향상 (표준 TSSOP 또는 SOIC 대비)
Q & A
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