작고 효율적인 패키지

Amkor’s ExposedPad (ePad) TSSOP, MSOP, SOIC & SSOP are leadframe based, plastic encapsulated packages suited for applications requiring optimal thermal performance, compressed body size and tightened lead pitch. ePad Thin-Shrink Small Outline Package, Micro Small Outline Package, Small Outline Integrated Circuit and Shrink Small Outline Packages (TSSOP, MSOP, SOIC & SSOP) offer a substantial increase in heat dissipation, yield a significant reduction in size and provide value-added, low-cost solutions for a wide range of applications. New developments include stealth dicing (narrow saw streets), larger/higher density leadframe strips and leadframe roughening for improved Moisture Sensitivity Level (MSL) capability.

특징

  • Cu wire interconnect for the lowest cost
  • 표준 JEDEC 패키지 규격
  • 멀티 다이 조립 생산 능력
  • strip 테스트 옵션을 포함한 Turnkey 테스트 서비스
  • 열 효율 향상을 위한 ExposedPad 구조
  • 열 저항의 최대 60% 향상 (표준 TSSOP 또는 SOIC 대비)

Q & A

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