塑料引脚框架封装,以满足紧凑的空间需求
TSSOP (Thin Shrink Small Outline Package) and MSOP (Mini Small Outline Package) are leadframe based, plastic encapsulated packages that are well suited for applications requiring less than 1 mm mounted height. These industry-standard packages run in very high volume and provide a value-added, low-cost solution for a wide range of applications.

特色
- 最低成本的铜线互连
- 标准 JEDEC 封装外形
- 多晶粒制造能力
- 一站式测试服务、包括条带测试选项
- 提供 ExposedPad 配置
- 标准绿色材料—无铅且符合 RoHS 要求
- 隐形切割(更窄切割道)
- 更大/更高密度的引线框架条带
- 引线框架粗糙化,以优化 MLS 功能
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