塑料引脚框架封装,以满足紧凑的空间需求

TSSOPs (Thin-Shrink Small Outline Packages) and MSOPs (Micro Small Outline Packages) are leadframe-based and plastic encapsulated, suited for applications requiring 1 mm or less mounted height. TSSOPs/MSOPs are industry standard and run in very high volume. They provide a value-added, cost-effective solution for a wide range of applications. New developments include larger/higher density leadframe strips and leadframe roughening for improved Moisture Sensitivity Level (MSL) capability.

特色

  • 铜线互连,以降低成本
  • 标准 JEDEC 封装外形
  • 多晶粒制造能力
  • 一站式测试服务、包括条带测试选项
  • 提供 ExposedPad 配置

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