塑料引脚框架封装，以满足紧凑的空间需求
TSSOPs (Thin-Shrink Small Outline Packages) and MSOPs (Micro Small Outline Packages) are leadframe-based and plastic encapsulated, suited for applications requiring 1 mm or less mounted height. TSSOPs/MSOPs are industry standard and run in very high volume. They provide a value-added, cost-effective solution for a wide range of applications. New developments include larger/higher density leadframe strips and leadframe roughening for improved Moisture Sensitivity Level (MSL) capability.
特色
- 铜线互连，以降低成本
- 标准 JEDEC 封装外形
- 多晶粒制造能力
- 一站式测试服务、包括条带测试选项
- 提供 ExposedPad 配置
有问题？
点击下方的 “获取信息“ 按钮，联系 Amkor 专业人士。