适用于更小型设计的薄型、热性能优化功率离散封装

The PSMC power discrete package from Amkor is part of our FLAT series of compact surface mount packages that is thinner and thermally enhanced, allowing for miniaturization. The copper clip interconnects structure of the PSMC package reduces electrical resistance and enhances thermal performance as compared to wire-bonded products.

With both 2 and 3 lead versions available, this package is suitable for both high-efficiency diodes as well as transistors such as Schottky Barrier Diodes (SBD), rectifier and Zener diodes, Transient Voltage Suppressors (TVS) and MOSFETs. New developments include larger/higher density leadframe strips and environmentally friendly Pb-free solder paste. This package may also be known as TO277-A, SMPC or CFP15.

特色

  • 铜连接器结构,以降低电感与电阻
  • 优化热性能
  • 从晶圆探针到测试与封装的一站式服务
  • 绿色材料:无铅电镀和无卤素模塑化合物

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