以晶圆级封装实现任何封装方案

Amkor offers a broad array of Wafer Level Packaging (WLP) capabilities and processes for packaging schemes from fan-out to chip scale to 3D to System-in-Package (SiP). Our advanced manufacturing operations in Korea, China, Taiwan, and Portugal are adjacent to major foundries, enabling the integration of factory logistics and reducing time-to-market.

The WLP family is applicable for a wide range of semiconductor device types while leveraging the smallest form factor and high performance from high-end RF WLAN combo chips, to FPGAs, power management, Flash/EEPROM, integrated passive networks and standard analog.

WLCSP

在高性能、小型封装中拥有更高的半导体容量

WLCSP+

优异产品稳健性的封装解决方案

WLFO

实现 3D 多元件封装设计的灵活性

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