客户封装设计的成功与否取决于建模和测量的准确性

无论客户的硅晶片是 RF、混合信号或是高速数字设计,Amkor 拥有优化封装设计并发挥出其全部特性的工具和经验。

机械封装特性

Mechanical characterization is an integral part of Amkor’s product development and characterization. From the product definition stage to performance prediction to validation and reliability testing, Amkor can help measure all relevant mechanical properties of a customer’s device.

热封装特性

Amkor offers advanced thermal test measurement and state-of-the-art modeling capabilities supporting all major electronic packaging styles and system level characterization. We maintain a library of JEDEC standard test boards and can also provide custom board design. In addition, custom thermal solutions are available to optimize component-level designs.

电子封装

当今的高速数字及 RF 电路设计的成功,高度依赖于建模和测量准确性,包括封装特性等。Amkor 所采用的方法由各种电气模型组合而成,它们以 2D、3D、全波段 3D 封装模拟和时间及频域测量为基础。

有问题?

点击下方的 “获取信息“ 按钮,联系 Amkor 专业人士。