适用于高密度、复杂堆叠组合的创新外观造型规格的解决方案

The FlipStack® CSP utilizes Amkor’s industry-leading ChipArray® BGA (CABGA) manufacturing capabilities, in combination with Amkor’s flip chip CSP (fcCSP) technology.

FlipStack CSP technology enables the stacking of a wide range of different semiconductor devices to deliver the high level of silicon integration and area efficiency required in portable multimedia products. This extensive high-volume infrastructure enables the rapid deployment of advances in die stacking technology across multiple products and factories to achieve the lowest total cost.

FlipStack CSP uses high-density thin core substrates, advanced wafer thinning, die attach, flip chip and wire bonding capabilities to stack multiple devices in a conventional fine-pitch ball grid array (FBGA) surface mount package. Many customers have relied on Amkor to solve their highest density and most complex device stack combinations.

Portable multi-media devices including cell phones, digital cameras, PDAs and audio players employ FlipStack CSP solutions to address a range of design requirements such as lower cost and smaller, lighter and more innovative new product form factors. Additional applications include gaming, automotive and computing.

特色

  • 3-15 毫米封装尺寸
  • 封装高度缩小至 0.6 毫米
  • 设计、组装和测试能力,实现了 I/O 数量为 50 至 1100 的存储器、逻辑及混合信号类型设备的堆叠组合
  • 以标准 CABGA 和 fcCSP 面积建立封装基础设施
  • 一贯的高成品率且可靠的产品性能

  • 晶粒悬空式焊线
  • 焊线线弧小于 40 微米
  • 晶圆减薄:焊线至 40 微米、凸块晶圆至 75 微米、铜柱凸块晶圆至 50 微米
  • 无铅,符合 RoHS 要求的绿色材料
  • 被动元件集成
  • JEDEC 标准外形,包括 MO-192、MO-195、MO-216、MO-219 和 MO-298

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