以标准及热性能优化封装灵活解决方案支持传统电路板设计

Amkor’s Metric Quad Flat Pack (MQFP) offers customers a legacy package with updated materials that extend the life of older board designs. The heat spreader option expands design margins on thermally challenging designs.

Amkor employs up-to-date materials and processes to assure a successful, reliable performance of IC chips providing security and convenience. Some MQFP designs and applications require an added margin of thermal performance (power). Amkor’s easy and cost-effective solution is a heat spreader. This optional embedded thermal aid improves Theta JA as much as 15% (without external heat sinks or fans) by supplementing the heat dissipation path from the IC chip to the printed circuit board.

Amkor’s MQFP line is adapted to meet the increasing challenges of microcontrollers, analog controllers, ASICs, and other technologies. These packages fill application needs in consumer, commercial, office, automotive, PC, industrial and other product areas.

特色

  • 10 x 10 毫米至 28 x 28 毫米封装尺寸
  • 44-280 个引脚数量
  • A broad selection of die pad sizes on open-tooled leadframes
  • Die-up and down configurations
  • 高电导性铜引脚框架
  • 符合 JEDEC 标准的封装外形
  • 采用散热片以实现集成热性能优化
  • 定制引脚框架设计
  • 小节距焊线功能

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