以标准及热性能优化封装灵活解决方案支持传统电路板设计

Amkor’s MQFP (Metric Quad Flat Pack) packages allow IC packaging engineers and systems designers the flexibility of growing or shrinking IC package size based upon application need. Amkor uses the most up-to-date materials and processes along with advanced equipment, to ensure the successful, reliable performance of our IC devices. A complete line of MQFP packages is available to provide security, convenience and success. Amkor’s MQFP line is adapted to meet the increasing challenges of advanced Digital Signal Processors (DSP), microcontrollers, ASIC, gate arrays (FPGA/PLD), and other technologies. These packages fill application needs in commercial, automotive, industrial and other product areas.

特色

  • 10 x 10 mm to 32 x 32 mm body size
  • 44-240 个引脚数量
  • 晶粒向上和向下配置
  • 高电导性铜引脚框架
  • 符合 JEDEC 标准的封装外形
  • 采用散热片以实现集成热性能优化
  • 定制引脚框架设计
  • Fine pitch wirebond capability
  • 无铅材料组合

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