低剖面引脚框架封装

Amkor’s Thin Small Outline Package (TSOP) is a leadframe-based, plastic encapsulated package suited for memory products, including SRAM, FLASH, FSRAM, and EEPROMs. A green BOM is standard, allowing devices to meet applicable Pb-free and RoHS standards. Amkor has a broad base of resources available to help customers bring quality new products to market quickly and at the lowest possible cost.

特色

  • 铜线或金线互连,以降低成本
  • 标准 JEDEC 封装外形
  • 优化设计,以适用于存储器应用
  • 最高达 4 倍堆叠晶粒,包括阶梯式及线包覆胶膜 (FoW) 结构
  • 一站式测试服务、包括条带测试选项

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