轻型、薄型封装解决方案

Amkor offers a broad line of TQFP (Thin Quad Flat Pack) IC packages. These packages allow IC packaging engineers, component specifiers and systems designers to solve issues such as increasing board density, die shrink programs, thin end‑product profile and portability. Amkor’s TQFPs are an ideal package for most IC semiconductor technologies such as ASIC, gate arrays (FPGA/PLD), microcontrollers and PMIC controllers. TQFP packages are particularly well suited for electronic systems applications requiring broad performance characteristics, including computing, video/audio, telecommunications, data acquisition, communication boards (ethernet, ISDN, etc.), set-top box and automotive.

特色

  • 5 x 5 毫米至 20 x 20 毫米封装尺寸,1.0 毫米封装厚度
  • 32-176 个引脚数量
  • 大量晶粒垫板尺寸选项
  • 预镀框架
  • 支持倒装垫板配置
  • 定制引脚框架设计
  • 铜线、金线和银线选项
  • 无铅且符合 RoHS 要求的材料

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