活动

IMAPS – Technology Crossover Extravaganza

Amkor Technology invites you to join us at the IMAPS – Technology Crossover Extravaganza Global Virtual Event on April 26-29, 2021.

Amkor 将发表下列演讲：

“Chip Scale Power Transistor Packaging”
Shaun Bowers， Amkor Technology 先进封装集成副总裁

“Design of Subsystem Module Package for Power Distribution Network”
HoJeong Lim， Amkor Technology Korea IC 封装设计总监

“Power Packaging Trends in Emerging 48V Ecosystem”
Ajay Kumar Sattu 博士，Amkor Technology 汽车产品营销高级经理