IMAPS – Technology Crossover Extravaganza

Amkor Technology invites you to join us at the IMAPS – Technology Crossover Extravaganza Global Virtual Event on April 26-29, 2021.

Amkor will be presenting the following:

“Chip Scale Power Transistor Packaging”
Shaun Bowers, VP – Mainstream Advanced Package Integration at Amkor Technology

“Design of Subsystem Module Package for Power Distribution Network”
HoJeong Lim, Director – IC Package Design at Amkor Technology Korea

“Power Packaging Trends in Emerging 48V Ecosystem”
Dr. Ajay Kumar Sattu, Sr Manager, Automotive Product Marketing at Amkor Technology

When: April 26, 2021 - April 29, 2021 Where: VIRTUAL Location: VIRTUAL

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