活动

ICCAD China 2018

Amkor Technology invites you to join us at ICCAD China 2018 on November 29-30, 2018 in Zhuhai, China.

John Lee, Director – GC Customer System Engineering at Amkor, will be presenting “Advanced Heterogeneous Packaging Solutions – 2.5D Package and HDFO” on November 30th at 13:50 during the Advanced Packaging and Testing Forum.

Amkor 将在此活动中和在场的封装专家一道进行演示，回答问题并讨论您的 IC 封装需求。