ICCAD China 2018

Amkor Technology invites you to join us at ICCAD China 2018 on November 29-30, 2018 in Zhuhai, China.

John Lee, Director – GC Customer System Engineering at Amkor, will be presenting “Advanced Heterogeneous Packaging Solutions – 2.5D Package and HDFO” on November 30th at 13:50 during the Advanced Packaging and Testing Forum.

Amkor 将在此活动中和在场的封装专家一道进行演示,回答问题并讨论您的 IC 封装需求。

When: November 29, 2018 - November 30, 2018 Where: Zhuhai, China Location: Zhuhai International Convention & Exhibition Center

更多未来大事件

IMAPS 先进 SiP 技术虚拟会议

SiP Conference China 2021

MEMS World Summit 2021 – 欧洲