ICCAD China 2018

Amkor Technology invites you to join us at ICCAD China 2018 on November 29-30, 2018 in Zhuhai, China.

John Lee, Director – GC Customer System Engineering at Amkor, will be presenting “Advanced Heterogeneous Packaging Solutions – 2.5D Package and HDFO” on November 30th at 13:50 during the Advanced Packaging and Testing Forum.

앰코 패키징 전문가들과의 질의응답 시간을 통해 궁금증을 해소하고 IC 패키징의 미래를 논의하시기 바랍니다.

When: November 29, 2018 - November 30, 2018 Where: Zhuhai, China Location: Zhuhai International Convention & Exhibition Center

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