イベント

ICCAD China 2018

Amkor Technology invites you to join us at ICCAD China 2018 on November 29-30, 2018 in Zhuhai, China.

John Lee, Director – GC Customer System Engineering at Amkor, will be presenting “Advanced Heterogeneous Packaging Solutions – 2.5D Package and HDFO” on November 30th at 13:50 during the Advanced Packaging and Testing Forum.

このイベントでは弊社の担当者が直接、お客様のICパッケージングのニーズに関するご質問・ご相談に対応させていただきます。