Events

ICCAD China 2018

Amkor Technology invites you to join us at ICCAD China 2018 on November 29-30, 2018 in Zhuhai, China.

John Lee, Director – GC Customer System Engineering at Amkor, will be presenting “Advanced Heterogeneous Packaging Solutions – 2.5D Package and HDFO” on November 30th at 13:50 during the Advanced Packaging and Testing Forum.

Amkor will be exhibiting at this event with our packaging experts on hand to answer questions and discuss your IC packaging needs.